Surface Mount Technology (SMT) is a technology of soldering electrical components onto the pre-printed circuit boards. In order to make the whole process possible, SMT reflow soldering oven is usually used. This is a machine that employs high level of technology and bonding principles in its functionality. It is very complex but offers reliability and better alternative in the field of electrical assembly. This comes with advantages such as reduced board cost, controlled manufacturing and assembling process and reduced material handling.
The reflow soldering is the process of joining electronic devices to the printed circuit boards as the contact pads. This requires the use of solder paste and heat to attach the components. It is the SMT reflow soldering oven that is best in this. It allows for better control of heating process that minimizes chances of defective components.
It all starts by making of solder paste. This is a mixture of small solder particles, flux and some solvent that also work as a cleaning agent. This forms a sticky substance that is used to loosely attach electrical components on to specific points on the circuit board.
The PCB and loosely attached components is then drawn into the heating chambers through a conveyor belt. This then undergoes into four distinct phases in this machine. The first phase is known as preheat zone. This is where the melting point of the solvent is set. The ramp rate (time/temperature rate) is also determined and used to control heating in the following stages.
The second zone is the thermal soak zone. Removal of paste volatiles takes place here through a 60 to 120 second heat exposure of the PCB at a predetermined temperature. This is followed by the reflow stage, the stage in which the whole thing happens. Printed circuit board and components are exposed to the highest possible temperatures. The tolerable (liquidus) temperature for each of the component is determined and the maximum temperature is set just below it. This forces reduction between the surface tension between solder particles so that they melt at the point of contact on the pad.
The cooling zone is the last phase where controlled cooling is done to avoid thermal shock. This result of this is permanent bonding of the electrical components to PCB ready for use in electronic market after cleaning and testing.
Most of these ovens use ceramic heaters as the source of heat. The heat flows to the assemblies through hot air using fan (radiation) or just the infrared electromagnetic radiation. As the new models are introduces, the techniques of heat transfers are improved.
SMT reflow soldering oven comes with a number of advantages such as simpler and much faster automated assemblies, very small levels of errors in component mounting, high level of production rate (some capable of placing up to 136,000 components per hour), possible to mount components on both side of the PCB, and electrical efficiency.
The revolution in technology has seen production of better SMT reflow soldering ovens with the latest ones being very efficient in energy consumption, capable of large volume of production thus reducing assembly and handling time and with better quality finished products which all translates to higher profits for the firm and better and safer electronics.
The reflow soldering is the process of joining electronic devices to the printed circuit boards as the contact pads. This requires the use of solder paste and heat to attach the components. It is the SMT reflow soldering oven that is best in this. It allows for better control of heating process that minimizes chances of defective components.
It all starts by making of solder paste. This is a mixture of small solder particles, flux and some solvent that also work as a cleaning agent. This forms a sticky substance that is used to loosely attach electrical components on to specific points on the circuit board.
The PCB and loosely attached components is then drawn into the heating chambers through a conveyor belt. This then undergoes into four distinct phases in this machine. The first phase is known as preheat zone. This is where the melting point of the solvent is set. The ramp rate (time/temperature rate) is also determined and used to control heating in the following stages.
The second zone is the thermal soak zone. Removal of paste volatiles takes place here through a 60 to 120 second heat exposure of the PCB at a predetermined temperature. This is followed by the reflow stage, the stage in which the whole thing happens. Printed circuit board and components are exposed to the highest possible temperatures. The tolerable (liquidus) temperature for each of the component is determined and the maximum temperature is set just below it. This forces reduction between the surface tension between solder particles so that they melt at the point of contact on the pad.
The cooling zone is the last phase where controlled cooling is done to avoid thermal shock. This result of this is permanent bonding of the electrical components to PCB ready for use in electronic market after cleaning and testing.
Most of these ovens use ceramic heaters as the source of heat. The heat flows to the assemblies through hot air using fan (radiation) or just the infrared electromagnetic radiation. As the new models are introduces, the techniques of heat transfers are improved.
SMT reflow soldering oven comes with a number of advantages such as simpler and much faster automated assemblies, very small levels of errors in component mounting, high level of production rate (some capable of placing up to 136,000 components per hour), possible to mount components on both side of the PCB, and electrical efficiency.
The revolution in technology has seen production of better SMT reflow soldering ovens with the latest ones being very efficient in energy consumption, capable of large volume of production thus reducing assembly and handling time and with better quality finished products which all translates to higher profits for the firm and better and safer electronics.
